Henkel, Nexa3D Launch Ultrafast Photopolymer for Rapid Prototyping


The xPRO410 material for general purpose prototyping has a formulation based on Henkel’s Loctite PRO410 polymer and optimized for the Nexa3D’s NXE400 3D printer.

Formlabs Offers Resins for Dental, Manufacturing, Engineering Sectors


Formlabs’ Rigid 10K Resin offers high stiffness and resistance for use in manufacturing and engineering, while a reformulated Draft Resin is well-suited for rough prototypes and quick design iterations.

SLM Solutions‘ NXG XII 600 Enables High-Volume Production


Machine features 12 lasers designed to use in serial production for high-volume applications as well as for printing large parts.

AM Solutions Updates S1 Postprocessing for Depowdering


System ensures postprocessing tasks are handled more efficiently, safer and more consistently.

ParaMatters’ CogniCAD 4.0 Delivers Smooth, Automated Workflow


Design platform enables both digital and traditional manufacturers to automate design-to-manufacturing processes.

PostProcess’ Demi 4000 Optimizes Automated SLA Resin Removal


Demi 4000 utilizes PostProcess’ submersible technology for consistent, hands-free resin removal on large part sizes or large builds with many smaller sized stereolithography parts.

Velo3D’s Sapphire XC Large-Format 3D Metal Printer Increases Throughput


Extra capacity, large-format printer can increase production throughput by five times and reduce cost-per-part by up to 75%, compared to its predecessor.

Nexa3D’s xCure Provides Optimal Curing of Photoplastics


Intelligent postprocessing system is designed to enable consistent part performance at production scale.

Essentium’s DryBox Stores, Protects 3D Materials


Storage system maintains optimum environment for materials to extend shelf life, yield more consistent prints and produce better part quality.

ALM’s Polypropylene Powder Offers Higher Elongation at Break


PP 400 polypropylene powder for selective laser sintering provides better impact resistance for use in dynamic environments.