7/6/2017

Henkel and HP Partner to Develop Material Solutions for 3D Printing

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Henkel joins the HP Open Materials and Applications Platform to develop customized material solutions for HP’s 3D printing customers.

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Henkel has joined the HP Open Materials and Applications Platform and will work with HP in its 3D Materials and Applications lab to develop customized, industry-specific solutions for HP Multi Jet Fusion customers.  
 
Henkel’s technology portfolio includes engineered thermal and light cure acrylic, silicone, epoxy, and polyurethane adhesives, sealants and coatings that are used to assemble products such as medical components, electronic devices and transportation vehicles. Henkel says that its polyamide synthesis and formulation knowledge will allow it to offer products that will work with HP’s Multi Jet Fusion platform.
 
In addition, the company says that its understanding of manufacturing process integration will be an advantage in accelerating the transition of additive manufacturing to production settings. Henkel‘s geographic footprint and sales channel is expected to facilitate the implementation of additive manufacturing on a larger scale.

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